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CeraDiodes
High-speed series
Storage
Only store CeraDiodes in their original packaging. Do not open the package before storage.
Storage conditions in original packaging: temperature -25 to +45 ° C, relative humidity ≤ 75% an-
nual average, maximum 95%, dew precipitation is inadmissible.
Do not store CeraDiodes where they are exposed to heat or direct sunlight. Otherwise the
packaging material may be deformed or CeraDiodes may stick together, causing problems dur-
ing mounting.
Avoid contamination of the CeraDiode surface during storage, handling and processing.
Avoid storing CeraDiodes in harmful environments where they are exposed to corrosive gases
for example (SO x , Cl).
Use CeraDiodes as soon as possible after opening factory seals such as polyvinyl-sealed pack-
ages.
Solder CeraDiodes after shipment from EPCOS within the time specified: 12 months.
Handling
Do not drop CeraDiodes and allow them to be chipped.
Do not touch CeraDiodes with your bare hands - gloves are recommended.
Avoid contamination of the CeraDiode surface during handling.
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
Mounting
When CeraDiodes are encapsulated with sealing material or overmolded with plastic material,
be aware that potting, sealing or adhesive compounds can produce chemical reactions in the
CeraDiode ceramic that will degrade its electrical characteristics and reduce its lifetime.
Make sure an electrode is not scratched before, during or after the mounting process.
Make sure contacts and housings used for assembly with CeraDiodes are clean before mount-
ing.
The surface temperature of an operating CeraDiode can be higher. Ensure that adjacent com-
ponents are placed at a sufficient distance from a CeraDiode to allow proper cooling.
Avoid contamination of the CeraDiode surface during processing.
Only CeraDiodes with an Ni barrier termination are approved for lead-free soldering.
Soldering
Complete removal of flux is recommended to avoid surface contamination that can result in an
instable and/or high leakage current.
Use resin-type or non-activated flux.
Bear in mind that insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended, otherwise a component may crack.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 20 of 22
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